EuroSOI - ULIS 2017

Students - Late Description + € 380.00 Registrations period has ended.
Full Registration - Late Description + € 480.00 Registrations period has ended.
Accompanying Person - Late Description + € 130.00 Registrations period has ended.


A very warm welcome to the 3rd joined EUROSOI - ULIS 2017 Conference, here in Athens! This Conference aims at gathering together in an interactive forum all scientists and engineers working in the field of SOI technology and advanced nanoscale devices. One of the key objectives of the conference is to promote collaboration and partnership between different academia, research and industry players in the field. This year the joint EUROSOI-ULIS event will be hosted by the Institute of Nanoscience & Nanotechnology of NCSR “Demokritos” in Athens, Greece.


Topics include, but are not limited to :

  • Advanced SOI materials and wafers. Physical mechanisms and innovative SOI-like devices.
  • New channel materials for CMOS: strained Si, strained SOI, SiGe, GeOI, III-V and high mobility materials on insulator; carbon nanotubes; graphene and other two-dimensional materials.
  • Properties of ultra-thin films and buried oxides, defects, interface quality. Thin gate dielectrics: high-k materials for switches and memory.
  • Nanometer scale devices: technology, characterization techniques and evaluation metrics for high performance, low power, low standby power, high frequency and memory applications.
  • Alternative transistor architectures including FDSOI, DGSOI, FinFET, MuGFET, vertical MOSFET, Nanowires, FeFET and Tunnel FET, MEMS/NEMS, Beyond-CMOS nanoelectronic devices.
  • New functionalities in silicon-compatible nanostructures and innovative devices representing the More than Moore domain, nanoelectronic sensors, biosensor devices, energy harvesting devices, RF devices, imagers, etc.
  • CMOS scaling perspectives; device/circuit level performance evaluation; switches and memory scaling. Three-dimensional integration of devices and circuits, heterogeneous integration.
  • Transport phenomena, compact modeling, device simulation, front- and back-end process simulation.
  • Advanced test structures and characterization techniques, parameter extraction, reliability and variability assessment techniques for new materials and novel devices.


Monday, April 3, 2017 9:00 AM
Wednesday, April 5, 2017


Divani Caravel
Leoforos Vasileos Alexandrou 2-6
161 21 Kesariani
Athens, Greece

Click for larger map